Patterning Mask
Patterning Mask
CMP & Dicing


CMP Dicing


Buysemi supply the product that is processed by CMP (Chemical Mechanical Polished) method.


The following is the kind of process available. Please click the quotation button of the process you choose. 


  CMP

  Si , Ceramic , Glass , Quartz wafer etc. ( ~8” )

 ​ TTV control

  The flatness of the substrate is adjustable to ± 1 μm.

  Typically TTV <15um. The Ra value can also be adjusted.  ​​

  The thinnest possible dimension

  >80um , Polishing both side.​

  Delivery

  Ready for shipping within 7 days

  Packing

  Carrier or Gel Pack and so on

  Minimum Order​ Quantity

  10 sheets​





Buysemi customize preferred size for he customer with dicing process.


  Dicing​

  Si , Ceramic , Glass , Quartz wafer, etc 2” ~ 12” )

  Dicing Blade width

  Si wafer : Typical 50um, Glass wafers : 150um

  Delivery​

  Ready for shipping within 10 days.​

  Packing​

  Carrier or Gel Pack (with protective film)

  Minimum Order Quantity

  25sheets






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