All of Wafer
Silicon wafer


Buysemi deals with silicon wafers of all specifications.



The following silicon wafers are available :


  Size of silicon water substrate

  2~12

  Type / Dopant

  P /Boron , N /Phous , N/As , N/sb , Undopped​​

  Orientation

  <100> , <111> , <110>​​

  Resistance value

  Low resistance(<0.005ohm.cm ) , General resistance (1-100ohm.cm), 

  High   resistance (>1kohm.cm)​​

  Thickness

  Thin (>80um), Standard thickness per each size, Thick.​

  Surface Finished

  Single side polished, double side polished.​

  Grade

  Reclaim , Dummy , Test , Prime​





Silicon wafer process


  Thickness control

  CMP ( Chemical Mechanical Polishing ), minimum processable thickness>80um,

  2~12

  TTV control

  TTV (Total Thickness Variation) manufactured from general maker is <15um, 

  but can work up to ± 1um through CMP process.

  Size control

 ​ Customize through Dicing process: 5mm*5mm, 10mm*10mm, etc.

  Silicon oxide deposition process

  thermal Oxidation ( 2~12 , 200A~Tens of um)

  PECVD (2~8)

  RF Sputtering ( 2~12) & DC Sputtering (2~12) All kinds of metals

  Si3N4 deposition

  LPCVD ( 4 , 6 , 8 ) , Low Stress , Thickness : 1,000A~2um

  Metal deposition process

  DC& RF Sputtering ( 2~12) , Evaporation ( 4 , 6 , 8)

  Patterning process

  Dry etching , Deep Si Etching , Lift off ( 4 , 6 , 8)

  Bonding

  SOI Wafer, SOG ( Silicon on Glass )

  Sandblaster

  Hole & Step Make ( 4 or 6 )



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