All of Wafer
Glass wafer


Buysemi works on glass wafers of all specifications.


Borofloat33, Sodalime, EagleXG, B270, etc. Buysemi can supply semiconductor process and other processing.



The following glass wafers are available :


  Glass substrate size

  2”~8” (8 inch: Flat or Notch ) or square shape.

  Glass material

  Sodalime , EagleXG , Borofloat33 , B270 , others, etc.

  Thickness of glas substrate

  80um~Thickness can be customized but generally 0.5T is a standard thickness.

  Flat type

 ​ Round , 1Flat , 2Flat , Notch

  Surface condition

  single side polished , double side polished

  Warp

  <0.1 / 100mm​

  Scratch / Dig

  60 / 40um​

 ​ Chip

  >0.5mm : 0ea​

 ​ Particle

  >10um@50k Lux : 0ea​

 ​ Package​​​

  Packing to be class 1000 cleanroom​





Glass wafer process


  Thickness control

  CMP (Chemical Mechanical Polishing), minimum processable thrickness>80um, 

  2~12

  TTV control

  TTV (Total Thickness Variation) manufactured by general manufacturer is <10um, 

  but can work up to ± 1um through CMP process.

  Size control

  Customize through Dicing process: 5mm*5mm, 10mm*10mm, etc. 

  Silicon oxide deposition(SiO2)

  PECVD (2~8)

  RF Sputtering (2~12) & DC Sputtering (2~12) All kinds of metals.

  Metal deposition

  DC& RF Sputtering (2~12) , Evaporation (4, 6, 8)

  Patterning process

  Dry etching, Lift off ( 4, 6, 8)

  Sandblaster

  Hole & Step Make ( 4 or 6 )

  Bonding Process

 ​ SOG ( Silicon on Glass )





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